The Semiconductor Grade Curved Plate Quartz Boats is a high-purity wafer carrier specifically designed for batch processing in high-temperature semiconductor fabrication steps such as diffusion, oxidation, and CVD deposition. Crafted from semiconductor-grade fused quartz, this boat offers superior thermal stability, low thermal expansion, and excellent resistance to chemical corrosion and thermal shock.

Its bent plate structure provides stable wafer support and ensures even gas distribution and heat transfer throughout the furnace tube. The precisely machined surface allows accurate wafer placement and spacing, minimizing mechanical stress and reducing the risk of particle contamination. With high optical transparency and ultra-low impurity content, this quartz boat meets the strict cleanliness and durability standards required in advanced semiconductor production and R&D environments.

 Issues in Semiconductor Curved Plate Quartz Boats and How to Prevent

Semiconductor curved plate quartz boats are essential tools used to securely hold silicon wafers during high-temperature processes like diffusion, oxidation, and CVD deposition. Despite their robust design and high-purity materials, users may encounter certain issues that can affect performance and wafer quality. Understanding these common problems and preventive measures is key to maintaining process efficiency and prolonging the lifespan of your quartz bent plate boats.

1. Cracking and Thermal Shock

• Issue: Sudden temperature changes during processing or cooling can cause thermal shock, leading to cracks or fractures in the quartz boat.
• Prevention: Implement controlled heating and cooling ramps to minimize thermal stress. Avoid rapid temperature changes and ensure equipment is properly calibrated.

2. Surface Contamination

• Issue: Deposits of process residues or particles on the quartz surface can cause wafer contamination and impact process consistency.
• Prevention: Regularly clean quartz boats using semiconductor-grade cleaning agents and ultrasonic baths. Handle boats in cleanroom environments using proper tools to avoid introducing contaminants.

3. Warping and Deformation

• Issue: Prolonged exposure to high temperatures or mechanical stress can cause dimensional changes, affecting wafer alignment.
• Prevention: Use boats made from high-purity fused quartz with excellent thermal stability. Avoid mechanical shocks during transport and storage, and inspect boats regularly for signs of wear.

4. Impurity Incorporation

• Issue: Impurities within the quartz material or introduced during handling can transfer to wafers, degrading device performance.
• Prevention: Choose boats manufactured from ultra-high purity quartz with low impurity levels. Maintain strict cleanroom protocols during handling and storage.

5. Surface Roughness and Micro-Cracks

• Issue: Scratches or roughness on the quartz surface can become contamination sites and weaken structural integrity.
• Prevention: Handle boats gently with non-abrasive tools. Inspect surfaces regularly and replace boats exhibiting significant surface damage.