Name:
6-inch Quartz Showerhead
Function & Application:
The showerhead is located inside the reaction chamber and is covered with numerous fine holes to uniformly spray specialty process gases, covering the entire wafer surface. It generates highly consistent coatings or films by evenly distributing gases within the chamber, ensuring uniform deposition or etching on the wafer surface. It is used in PVD, CVD, PECVD, and etching processes, which are high-temperature processes.
Performance Requirements:
High temperature resistance, corrosion resistance, excellent thermal stability, sandblasted surface treatment, and low impurity content.
No.5177 Qianghua West Road, Dongqian Street, Nanxun District, Huzhou City, Zhejiang Province
+86-572-3032373
+86-572-3033016
Quartz Showerheads are precision-engineered components designed to deliver uniform gas distribution inside semiconductor reaction chambers during high-temperature processes such as PVD, CVD, PECVD, and etching. Featuring numerous finely drilled holes, these showerheads ensure that specialty process gases are evenly sprayed over the entire wafer surface, promoting consistent film deposition or etching across all wafers in the batch.
Manufactured from high-purity fused quartz, the showerheads offer excellent thermal stability, corrosion resistance, and low impurity content, essential for contamination-free processing. The sandblasted surface treatment enhances durability and minimizes particle generation, contributing to improved process control and higher device yields. Ideal for advanced semiconductor fabrication and research environments, quartz showerheads play a vital role in achieving precise and uniform wafer treatments.
Showerheads in semiconductor processing are essential for uniform gas distribution during thin-film deposition, etching, and high-temperature processes. Quartz, metal, and ceramic materials are commonly used, each offering unique properties that affect wafer quality, process stability, and equipment lifespan.
Quartz showerheads outperform metal and ceramic alternatives in high-purity, high-temperature semiconductor processes. They provide superior thermal stability, contamination control, and gas flow uniformity, making them ideal for critical wafer fabrication environments.